Solus Advanced Materials supplies high-end copper foil
based on foundation technique of ultra thin foil and coating.
Copper foil is used in various electronic equipment, and the core technology is to make the surface smooth and thin.
Solus Advanced Materials is the only copper foil manufacturer in Europe, and we steadily enhance our competitiveness in the global market based on 60 years’ of manufacturing experience and know-how.
Business information
Solus Advanced Materials supplies high-end copper foil based on foundation technique of ultra thin foil and coating.
Copper foil is used in various electronic equipment, and the core technology is to make the surface smooth and thin.
Solus Advanced Materials is the only copper foil manufacturer in Europe, and we steadily enhance our competitiveness in the global market based on 60 years’ of manufacturing experience and know-how.
By securing the world's thinnest 1.5㎛ ultra-thin foil manufacturing technology, we are contributing to circuit microtization, increased integration, and high multilayering of PCB boards.
With the recent use of Solus Advanced Materials' copper foil in GPUs for artificial intelligence (AI) servers, our technology is being recognized by the big global tech companies.
Strength
- Holding the world’s leading thin foil manufacturing technology
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- Manufacturing less than 2um ultra-thin foils, having manufacturing methods suitable for making high-end PCB (Electronic circuit board) micro-circuit, highly sensitive and integrated, and multi-layered
- High-end copper foil for artificial intelligence (AI) server GPUs
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- We manufacture copper foil that minimizes signal loss by forming a roughness of 1.0㎛ or less (Rz JIS standard) using uniform surface treatment technology. This is being applied to GPUs for artificial intelligence (AI) servers.
- Holding copper foil technology for the IC/USIM card
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- Providing copper foils suitable for IC cards and USIM cards using special surface treatment technology to prevent damage from external environment such as moisture, including copper foil manufacturing technology with high strength and high elongation
Product applications
- High performance multi-layer board
(AI semiconductor and network equipment substrate materials) - For IC and USIM cards
- Flexible substrate
(Smart phone, Etc.) - High-speed digital transmission
& low loss
(5G communication equipment,
base station radar, Etc.) - For PKG Substrate
(Semiconductor IC mounting substrate material)
Main Product
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- Hyper Very Low Profile (HVLP) (BFL-NN-Z, BFL-NX-Y)
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- Low surface roughness
- Has stable peel strength characteristics (over 0.5N/mm) with roughness of 0.6um or less (JIS standard)
- Used in AI semiconductors and network substrate materials for high-efficiency signal transmission
- Used in 5G communications equipment and 77Ghz radar parts for vehicles
- Thickness : 9~35um
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- Ultra-thin foil (DTH-N-TZA, DTH-ANP)
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- The 1.5um~5um thin product can be used for IC Packaging and HDI application.
- Can be used for Modified Semi-Additive Process, applicable at Line Space of 30/30um and below.
- Thickness: 1.5~5um
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- For Smart IC (LPT-TZA)
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- Copper foil for Smart IC
- High-strength, low-profile copper foil
- Optimized for reel-to-reel processes
- Excellent flatness characteristics for mounting high-performance IC chips
- Thickness: 18~70um
Manufacturing process
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- 1. Raw material
- High-purity raw materials received
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- 2. Dissolving
- Process of preparing electrolyte for plating
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- 3. Plating
- Process of producing copper foil of uniform thickness by plating Cu ion on drums in electrolyte solution
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- 4. Treating
- Process of roughening the copper foil surface and enhancing performance through coating and other treatment
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- 5. Slitting & Sheeting
- Slitting in the width direction of the copper foil according to customer demand size
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- 6. Inspection & Shipping
- Process of packing and shipping after quality inspection
Product classification
| Product name | Products by Application Type | Characteristic |
|---|---|---|
| BFL-NN & BFL-NX | For high-performance AI semiconductor substrate materials | Very low profile (roughness) (less than 0.6um) and excellent adhesive strength. The best signal transmission characteristics of any foil in existence. |
| BF-HFZ | Ultra high-Frequency application | Good bonding strength with fluoropolymer resin system and low roughness |
| BF-TZA & BF-HFI-LP2 | High speed digital application | Good bonding strength with very low loss laminate and very low roughness |
| BF-ANP | Ultra high speed digital application | Almost free profile with good bonding strength |
| TZA-B | Middle and low loss signal application | Reverse treatment type and low roughness |
| Doublethin™ | IC packaging and Advanced HDI for the fine patterning | Very thin foil (minimum 1.5um) with carrier foil |
| LPT-NP & LPT-TZA | Smart Card / Tape Carrier Substrate | Superior elastic modulus and high mechanical property |
| TWS | High Tg and engineering plastic laminate | High bonding strength at BT resin base prepreg |
| TWLS | Very low Dk laminate | High bonding strength at low Dk prepreg |
| BF-TZA-FX | Flexible application | Flexural ductility property and high bonding strength with PI film |
| Tza-TZA | For lightning prevention in aircraft/wind power generators, etc. | Excellent adhesive strength with double-sided surface treatment |
| TZA | Conventional multilayer laminate | Enhanced high temperature elogation |