Circuit Foil Luxembourg participated in the IPC APEX held in San Diego, CA in the United States from February 4 to 6, 2020.
We introduced the newly developed super flat copper foil, the leading edge technology for 5G market, and ultrathin carrier supported copper foils used in IC substrates and Substrates Like PCB design circuits with lines and spacing below 25 µm.
|Schedule||2020.02.04 ~ 2020.02.06||Exhibit time||09:00 ~ 18:00|
|Participating companies||About 490||Visitors||About 9,800|
|Location||SAN DIEGO CONVENTION CENTER|
Doosan Solus participated in In Cosmetics Global 2019, the largest cosmetics material exhibition in the industry, to run booths and seminars.
Cosmetics companies from all over the world attended the exhibition to share information on technologies and products with the latest industry trends such as raw materials for cosmetics, research and manufacturing facilities, and established its position as a leading global company in the global market.
|Schedule||2019.04.02 - 2019.04.04||Exhibit time||9:00 AM - 6:00 PM|
|Participating companies||About 850||Visitors|
|Location||Paris expo Porte de Versailles|
Circuit Foil Luxembourg plans to participate in the IPC APEX held in San Diego, CA in the United States from January 26 to 31, 2019.
We plan to introduce the newly developed ultra-thin copper foil for RF and high-speed digital circuits at the exhibit. The new product should be the core technology for the upcoming 5G.
Moreover, we intend to exhibit the new ultra-thin carrier designed specifically for IC boards and substrate-like PCB.
|Schedule||2019.01.26 - 2019.01.31||Exhibit time||9:00 AM - 6:00 PM|
|Participating companies||About 470||Visitors||About 26,000|
|Location||San Diego Convention Center|