Solus Advanced Materials

Circuit Foil Luxembourg (CFL), a copper foil manufacturing subsidiary of Solus Advanced Materials, attended IPC APEX EXPO, the largest Printed Circuit Board (PCB) Industry Trade Show in the United States, from March 18-20, 2025 in Anaheim, California.
The show was attended by PCB manufacturers, electronic manufacturing service (EMS) and original equipment manufacturing (OEM) companies from around the world. CFL took the show as an opportunity to network with a wide range of industry stakeholders in order to build partnerships and further collaborate with potential customers.

Solus Advanced Materials participated in the Korea Display Industry Exhibition (K-Display 2024), where it showcased its OLED materials technology.
The Korea Display Industry Exhibition is Korea’s only dedicated display industry exhibition. Now in its 23rd year, it has been representing the display industry since 2001. At this event, about 180 companies specializing in panels, materials, and equipment for the display field from Korea and overseas showcased their latest technologies. K-Display 2024 was hosted by the Ministry of Trade, Industry and Energy and organized by the Korea Display Industry Association (KDIA).

Solus Advanced Materials attended the International Meeting on Information Display (IMID) 2023.
This event is one of the world's two largest conferences on displays, and is an international conference that attracts more than 2,000 scholars and professionals from related industries, for research presentations and knowledge exchange in the field of information display. It is organized by the Korea Information Display Society (KIDS) and held every August.

Circuit Foil Luxembourg participated in the IPC APEX held in San Diego, CA in the United States from February 4 to 6, 2020.
We introduced the newly developed super flat copper foil, the leading edge technology for 5G market, and ultrathin carrier supported copper foils used in IC substrates and Substrates Like PCB design circuits with lines and spacing below 25 µm.

Circuit Foil Luxembourg plans to participate in the IPC APEX held in San Diego, CA in the United States from January 26 to 31, 2019.
We plan to introduce the newly developed ultra-thin copper foil for RF and high-speed digital circuits at the exhibit. The new product should be the core technology for the upcoming 5G.
Moreover, we intend to exhibit the new ultra-thin carrier designed specifically for IC boards and substrate-like PCB.